Gemalto's Cinterion PLAS9 IoT wireless module delivers high-performance LTE Advanced connectivity for demanding IoT applications such as industrial Routers and gateways, digital signage, industrial computers, and tablets. The best-in-class solution enables sizzling data speeds of 300 Mbit/s download and 50 Mbit/s uplink plus seamless fallback to 3G and 2G networks. It provides excellent coverage in both urban areas and regions where 4G is still emerging.
Built for longevity and performance, the optimized, ultra-rugged HW design enables easy migration from 2G to 3G all the way through LTE Advanced. It delivers reliability in extreme environments, temperatures, and voltage conditions and is verified through extensive cycles of field tests. In addition, a unique RF concept enables a minimum number of SKUs, which helps to simplify IoT solution design and logistics while lowering Total Cost of Ownership (TCO).
The PLAS9 is offered in variants for North America, EMEA and APAC delivering connectivity for LTE Category 6 with fallback to 3G and 2G when needed. The module supports carrier aggregation which allows Mobile Network Operators to combine two or more carriers into one data channel for enhanced data capacity, improved peak user performance and optimized use of spectrum.
The PLAS9 wireless module features: